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Asat Holdings Ltd · 20-F · For 4/30/04

Filed On 7/9/04 2:51pm ET   ·   SEC File 0-30842   ·   Accession Number 1193125-4-116140

  in   Show  and 
  As Of               Filer                 Filing     As/For/On Docs:Pgs              Issuer               Agent

 7/09/04  Asat Holdings Ltd                 20-F        4/30/04    9:348                                    RR Donnelley/FA

Annual Report of a Foreign Private Issuer   ·   Form 20-F
Filing Table of Contents

Document/Exhibit                   Description                      Pages   Size 

 1: 20-F        Annual Report of a Foreign Private Issuer           HTML  1,529K 
 2: EX-1.2      Restated Articles of Association of Asat Holdings      1      6K 
                          Limited                                                
 3: EX-4.6      Indenture Dated As of January 26, 2004               113    594K 
 4: EX-4.8      Lease Agreement Dated As of May 7, 2004               17     64K 
 5: EX-12.1     Certification of Chief Executive Officer Pursant       2±    11K 
                          to Section 302                                         
 6: EX-12.2     Certification of Chief Financial Officer Pursant       2±    11K 
                          to Section 302                                         
 7: EX-13.1     Certification of Chief Executive Officer Pursant       1      8K 
                          to Section 906                                         
 8: EX-13.2     Certification of Chief Financial Officer Pursant       1      8K 
                          to Section 906                                         
 9: EX-14.1     Consent of Independent Auditors                        1      7K 


20-F   ·   Annual Report of a Foreign Private Issuer
Document Table of Contents

Page (sequential) | (alphabetic) Top
 
11st Page
"Table of Contents
"General Information
"Forward-Looking Statements
"Glossary of Semiconductor Terms
"Identity of Directors, Senior Management and Advisers
"Offer Statistics and Expected Timetable
"Key Information
"Selected Financial Data
"Risk Factors
"Information on the Company
"History and Development
"Business Overview
"Organizational Structure
"Property, Plant and Equipment
"Operating and Financial Review and Prospects
"Critical Accounting Policies
"Operating Results
"Liquidity and Capital Resources
"Off-Balance Sheet Arrangements
"Research and Development
"Trend Information
"Directors, Senior Management and Employees
"Directors and Senior Management
"Compensation
"Board Practices
"Employees
"Share Ownership
"Major Shareholders and Related Party Transactions
"Major Shareholders
"Related Party Transactions
"Financial Information
"The Offer and Listing
"Additional Information
"Memorandum and Restated Articles of Association
"Material Contracts
"Exchange Controls and Other Limitations
"Taxation
"Documents on Display
"Quantitative and Qualitative Disclosures About Market Risks
"Description of Securities Other Than Equity Securities
"Defaults, Dividend Arrearages and Delinquencies
"Material Modifications to the Rights of Security Holders and Use of Proceeds
"Controls and Procedures
"Audit Committee Financial Expert
"Code of Ethics
"Principal Accountant Fees and Services
"Financial Statements
"Exhibit Index
"Signatures
"Index to Consolidated Financial Statements
"Report of Independent Auditors
"Consolidated Balance Sheets as of April 30, 2003 and 2004
"Consolidated Statements of Operations and Comprehensive Income (Loss) for the years ended April 30, 2002, 2003 and 2004
"Consolidated Statements of Shareholders Equity for the years ended April 30, 2002, 2003 and 2004
"Consolidated Statements of Cash Flows for the years ended April 30, 2002, 2003 and 2004
"Notes to Consolidated Financial Statements

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  Form 20-F  
Table of Contents

As filed with the Securities and Exchange Commission on July 9, 2004


 

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

 

FORM 20-F

 

¨ REGISTRATION STATEMENT PURSUANT TO SECTION 12(b) OR (g) OF THE SECURITIES EXCHANGE ACT OF 1934

 

x ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 FOR THE FISCAL YEAR ENDED APRIL 30, 2004

 

¨ TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934

 

Commission file number 000-30842

 

ASAT Holdings Limited

(Exact name of Registrant as specified in its charter)

 

ASAT Holdings Limited

(Translation of Registrant’s name into English)

 

Cayman Islands

(Jurisdiction of incorporation or organization)

 

14th Floor, 138 Texaco Road

Tsuen Wan, New Territories

Hong Kong

(Address of principal executive office)

 

Securities registered or to be registered pursuant to Section 12(b) of the Act:

 

Title of Each Class


 

Name of Exchange on which Registered


None   None

 

Securities registered or to be registered pursuant to Section 12(g) of the Act:

 

Class of ordinary shares, par value $0.01

 

Securities for which there is a reporting obligation pursuant to Section 15(d) of the Act:

 

None

 

Indicate the number of outstanding shares of each of the Issuer’s classes of capital or common stock as of the close of the period covered by the annual report:

 

Class


 

Number of shares outstanding as of April 30, 2004


Ordinary Shares, par value $0.01   676,972,865

 

Indicate by check mark whether the Registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days:

 

Yes  x        No  ¨

 

Indicate by check mark which financial statement item the registrant has elected to follow:

 

Item 17  ¨        Item 18  x

 



Table of Contents

 Table of Contents

 

     Page

GENERAL INFORMATION

   i

FORWARD-LOOKING STATEMENTS

   i

GLOSSARY OF SEMICONDUCTOR TERMS

   ii

 

PART I

 

ITEM 1.   

IDENTITY OF DIRECTORS, SENIOR MANAGEMENT AND ADVISERS

   1
ITEM 2.   

OFFER STATISTICS AND EXPECTED TIMETABLE

   1
ITEM 3.   

KEY INFORMATION

   2
    

SELECTED FINANCIAL DATA

   2
    

RISK FACTORS

   6
ITEM 4.   

INFORMATION ON THE COMPANY

   21
    

HISTORY AND DEVELOPMENT

   21
    

BUSINESS OVERVIEW

   21
    

ORGANIZATIONAL STRUCTURE

   36
    

PROPERTY, PLANT AND EQUIPMENT

   38
ITEM 5.   

OPERATING AND FINANCIAL REVIEW AND PROSPECTS

   38
    

CRITICAL ACCOUNTING POLICIES

   39
    

OPERATING RESULTS

   41
    

LIQUIDITY AND CAPITAL RESOURCES

   49
    

OFF-BALANCE SHEET ARRANGEMENTS

   51
    

RESEARCH AND DEVELOPMENT

   52
    

TREND INFORMATION

   53
ITEM 6.   

DIRECTORS, SENIOR MANAGEMENT AND EMPLOYEES

   54
    

DIRECTORS AND SENIOR MANAGEMENT

   54
    

COMPENSATION

   56
    

BOARD PRACTICES

   57
    

EMPLOYEES

   57
    

SHARE OWNERSHIP

   58
ITEM 7.   

MAJOR SHAREHOLDERS AND RELATED PARTY TRANSACTIONS

   59
    

MAJOR SHAREHOLDERS

   59
    

RELATED PARTY TRANSACTIONS

   61
ITEM 8.   

FINANCIAL INFORMATION

   62
ITEM 9.   

THE OFFER AND LISTING

   63
ITEM 10.   

ADDITIONAL INFORMATION

   64
    

MEMORANDUM AND RESTATED ARTICLES OF ASSOCIATION

   64
    

MATERIAL CONTRACTS

   67
    

EXCHANGE CONTROLS AND OTHER LIMITATIONS

   67
    

TAXATION

   67
    

DOCUMENTS ON DISPLAY

   72
ITEM 11.   

QUANTITATIVE AND QUALITATIVE DISCLOSURES ABOUT MARKET RISKS

   72
ITEM 12.   

DESCRIPTION OF SECURITIES OTHER THAN EQUITY SECURITIES

   73

 

PART II

 

ITEM 13.   

DEFAULTS, DIVIDEND ARREARAGES AND DELINQUENCIES

   74
ITEM 14.   

MATERIAL MODIFICATIONS TO THE RIGHTS OF SECURITY HOLDERS AND USE OF PROCEEDS

   74
ITEM 15.   

CONTROLS AND PROCEDURES

   74
ITEM 16A.   

AUDIT COMMITTEE FINANCIAL EXPERT

   74
ITEM 16B.   

CODE OF ETHICS

   74
ITEM 16C.   

PRINCIPAL ACCOUNTANT FEES AND SERVICES

   75

 

PART III

 

ITEM 17.   

FINANCIAL STATEMENTS

   76
ITEM 18.   

FINANCIAL STATEMENTS

   76
ITEM 19.   

EXHIBIT INDEX

   76

SIGNATURES

   77

INDEX TO CONSOLIDATED FINANCIAL STATEMENTS

   F-1


Table of Contents

 GENERAL INFORMATION

 

In this Annual Report, the terms “we,” “us,” “our,” our company,” “Company” and “ASAT” refer, as the context requires, either individually or collectively, to ASAT Holdings Limited (“ASAT Holdings”) and also to ASAT Limited (“ASAT HK”), ASAT, Inc., ASAT (Finance) LLC, Timerson Limited, ASAT (Cayman) Limited, ASAT Korea Limited, ASAT GmbH, ASAT (S) Pte Ltd., New ASAT (Finance) Limited, Newhaven Holdings Limited (“Newhaven”), RBR Trading Holding (Curaçao) N.V. (“RBR Antilles”) and R.B.R. Trading Holding B.V. (“RBR Netherlands”) which are each, direct or indirect, wholly owned subsidiaries of ASAT Holdings. Since ASAT S.A. has been under court administration since November 20, 2001, we no longer consolidate its financial results with our financial statements.

 

A “Glossary of Semiconductor Terms” set out definitions of technical terms used in this Annual Report.

 

We publish our financial statements in United States dollars, which are referred to as “Dollars” and “$”.

 

 FORWARD-LOOKING STATEMENTS

 

This Annual Report contains forward-looking statements and information that involve risks, uncertainties and assumptions. Forward-looking statements are all statements that concern plans, objectives, goals, strategies, future events or performance and underlying assumptions and other statements that are other than statements of historical fact, including, but not limited to, those that are identified by the use of words such as “anticipates,” “believes,” “estimates,” “expects,” “intends,” “plans,” “predicts,” “anticipates,” “projects” and similar expressions. Risks and uncertainties that could affect us include, without limitation, dependence on the highly cyclical nature of the semiconductor industry, our ability to rapidly develop and successfully bring to market advanced technologies and services, the incurrence of significant capital expenditures for manufacturing technology and equipment, the success of moving our assembly and test facilities from Hong Kong to Dongguan, operating new assembly and test facilities in China, our high leverage and the restrictive covenants contained in the agreements governing our indebtedness, fluctuating demand and continuous downward pressure on selling prices in the communications sector, inability to meet increased demands of customers, low capacity utilization rates, loss of a large customer, weaknesses in Asian economies, natural disasters, losses of power to our facilities in Dongguan, litigation with Motorola, volatility in the market prices of our ADSs, environmental regulation, fluctuations in foreign currency, uncertainty as to demand from our customers over both the long- and short-term, competitive pricing and declines in average selling prices we experience, the timing and volume of orders relative to our production capacity, complexity in our assembly processes, the availability of financing, competition and the greater operating and financial resources of competitors, ability to successfully complete potential acquisitions and integrate other parties into our business, dependence on raw material, equipment suppliers and the enforcement of intellectual property rights by or against us and the possible difficulties in obtaining additional financing. Should one or more of such risks and uncertainties materialize, or should any underlying assumption prove incorrect, actual outcomes may vary materially from those indicated in the applicable forward-looking statements. Any forward-looking statement or information contained in this document speaks only as of the date the statement was made.

 

All of our forward-looking statements made herein and elsewhere are qualified in their entirety by the risk factors discussed in Item 3 “Key Information—Risk Factors” and other cautionary statements appearing in Item 5 “Operating and Financial Review and Prospects” in this Annual report. These risk factors and statements describe circumstances which could cause actual results to differ materially from those contained in any forward-looking statement.

 

We do not intend to update or revise any forward-looking statements made herein to reflect actual results or changes in assumptions, future events or otherwise.

 

i


Table of Contents

 GLOSSARY OF SEMICONDUCTOR TERMS

 

This glossary contains definitions and other terms as they relate to our businesses and as they are used in this report. As such, these definitions may not correspond to standard industry definitions.

 

Array    A group of items (elements, leads, bonding pads, circuits, etc.) arranged in rows and columns.
BGA    A standard type of commodity semiconductor packaging known as a “ball grid array” where solder balls have been applied to the external electrical contacts on the package for subsequent use in electrically affixing the package to the corresponding leads on a printed circuit board.
Chip    An individual integrated circuit that has not yet been packaged. Also used as a generic term for semiconductor devices. Often called a “die”.
Chipset    Two or more chips designed to perform as a unit for one or more functions.
Chipscale packages    Any semiconductor package in which the package is approximately 1.2 times the size of the semiconductor chip.
Deposition    A term applied to growing thin layers within in a vacuum condensation mode, or via electroplating techniques.
Die    A synonym for a semiconductor “chip”.
Encapsulation    Enclosing the die in an organic medium which protects the die and wire bonds from the environment.
fpBGA    Fine Pitch Ball Grid Array. A distinct technically evolved version of a BGA package, mounted on tape substrate, that has a solder ball pitch of less than 1.0 mm.
FxBGA    A new and flexible advanced BGA package that is thinner, has a higher circuit density and improved electrical and thermal performance.
Flip chip    Type of PBGA package which uses an array of solder bumps on the bottom of the semiconductor chip to connect the chip to the balls on the bottom of the package.
Input/Output    A connector which interconnects the chip to the package or one package level to the next level in the hierarchy. Also referred to as pin-out connections or terminals. Sometimes referred to as “I/O.”
Integrated circuit    A combination of two or more transistors on a base material, usually silicon. All semiconductor chips, including memory chips and logic chips, are very complicated integrated circuits with thousands of transistors.
Laminate substrate    An organic substrate used for the routing of PBGA products between the chip pads and the solder ball pads.
Leadframe    A metal frame designed to connect to the bonding pads of the chip by lead, that provides rigidity, heat dissipation and electrical connection to external points.
LPCC    Our trademarked acronym for our Leadless Plastic Chip Carrier, a leadframe based chipscale package. The LPCC is the trademark for ASAT’s QFN product family.
Mixed signal products    Products that can process both digital and analog data signals.
Molding    Encapsulating the chip, leadframe and wirebondings in molded plastic with leads protruding. The molded plastic is an epoxy based material called “molding compound.”

 

ii


Table of Contents
MSL-1 Capability    Process technology which allows our leadframe based packages to achieve moisture sensitive level one. This technology allows for an assembled product shelf life of essentially unlimited duration.
MSP Technology    Multi-System in a Package Technology is customer specific technology incorporating multi-functions of a circuit in a single package.
PBGA    The acronym for a standard type of commodity BGA packaging known as “plastic ball grid array”, where the chip is placed on top of a laminate plastic substrate that has a grid of solder balls underneath for use in connecting the packaged device to a printed circuit board.
Pitch    The center-to-center distance between adjacent leads on a package.
Power management system    A class of semiconductor packages that incorporate features to increase the thermal dissipation properties of the package.
Printed circuit board    A laminate sheet made of organic materials with metallic interconnects into which integrated circuits are soldered. Wires on the board connect the circuits with each other, forming a larger functional unit. Printed circuit boards generally are a subsystem within a larger electronic system.
QFN    The acronym for the industry standard leadless chipscale package known as the “quad flat pack no lead” package type.
QFP    The acronym for the Quad Flat Pack, which is a semiconductor package with leads on all four sides attached to a printed circuit board by surface mounting.
SiP    The acronym for “system-in-package” devices. SiP packages contain numerous electrically interconnected active and passive semiconductor components.
Solder ball    A tin and lead alloy sphere that is attached to a BGA substrate to allow for printed circuit board attachment.
Substrate    The underlying material upon which a device, circuit, or epitaxial layer is fabricated, normally a silicon wafer.
Surface mounting    A printed circuit board packaging technique in which the leads (pins) on the chips and components are soldered directly onto the top of the board.
TAPP    Our trademarked acronym for our Thin Array Plastic Packaging Technology which provides metallic contacts to the circuit board allowing high density circuitry in a small footprint package.
TBGA    Tape Ball Grid Array, which is a BGA package with a more flexible substrate and higher density than conventional plastic packages.
TQFP    Thin Quad Flat Package, which is a standard leaded package.
Wafer    Thin, round, flat piece of silicon that is the base of most integrated circuits. Many individual semiconductor die are fabricated at the same time on one wafer. These die are then saw-singulated into individual semiconductor die or chips.
Wire bonding    The method used to attach very fine wire to semiconductor components in order to provide electrical continuity between the semiconductor chip and a terminal in the lead frame or substitute.

 

iii


Table of Contents

PART I

 

 ITEM 1. IDENTITY OF DIRECTORS, SENIOR MANAGEMENT AND ADVISERS

 

Not applicable.

 

 ITEM 2. OFFER STATISTICS AND EXPECTED TIMETABLE

 

Not applicable.

 

1


Table of Contents
 ITEM 3. KEY INFORMATION

 

 SELECTED FINANCIAL DATA

 

The following table represents selected historical consolidated financial data for ASAT for the five-year period ended April 30, 2004. The selected historical consolidated financial data below as of April 30, 2003 and 2004 and for the years ended April 30, 2002, 2003 and 2004 were derived from our audited consolidated financial statements as of such dates and for such periods included elsewhere in this Annual Report. The selected historical consolidated financial data below as of April 30, 2000, 2001 and 2002 and for the years ended April 30, 2000 and 2001 were derived from our audited consolidated financial statements as of such dates and for such periods, not included in this Annual Report. The financial information included in this Annual Report does not reflect our results of operations, financial position and cash flows in the future and our past operating results are no guarantee of our future operating performance. In this Annual Report, all references to fiscal years are to the Company’s fiscal years ended April 30th, thus the fiscal year 2004 refers to the fiscal year ended on April 30, 2004.

 

The selected historical consolidated financial data is qualified by reference to, and should be read in conjunction with, Item 5 “Operating and Financial Review and Prospects” and our consolidated financial statements and the related notes, included elsewhere in this Annual Report.

 

    Fiscal Year Ended April 30,

 
    2000

    2001

    2002

    2003

    2004

 
    (In thousands of dollars, except for share and ADS data)  

Statement of Operations Data:

                                       

Net sales

  $ 312,131     $ 340,236     $ 102,408     $ 150,090     $ 214,674  

Cost of sales

    199,636       244,484       132,533       140,366       174,275  
   


 


 


 


 


Gross profit (loss)

    112,495       95,752       (30,125 )     9,724       40,399  
   


 


 


 


 


Operating expenses:

                                       

Selling, general and administrative expenses

    26,453       37,631       30,368       24,215       24,775  

Research and development

    4,676       5,954       6,437       5,299       4,562  

Reorganization expenses

    —         2,603       2,327       713       —    

Impairment of property, plant and equipment

    12,340       —         —         81,807       2,387  

Facilities charge

    —         —         —         —         306  

Non-recoverable and unutilized architectural cost

    —         —         4,500       —         —    

Write-off in relation to ASAT S.A.  

    —         —         24,285       —         —    
   


 


 


 


 


Total operating expenses

    43,469       46,188       67,917       112,034       32,030  
   


 


 


 


 


Income (Loss) from operations

    69,026       49,564       (98,042 )     (102,310 )     8,369  

Other income (expense), net(1)

    1,048       6,451       (1,499 )     1,709       689  

Charges on early extinguishment of debt (3)

    —         (13,126 )     —         —         —    

Charges on early redemption of 12.5% senior notes (4)

    —         —         —         —         (10,346 )

Interest expense

    (18,994 )     (18,119 )     (14,246 )     (13,652 )     (15,425 )

Recapitalization costs(2)

    (6,813 )     —         —         —         —    
   


 


 


 


 


Income (Loss) before income taxes

    44,267       24,770       (113,787 )     (114,253 )     (16,713 )

Income tax (expense) benefit

    (9,558 )     (5,350 )     10,960       15,174       (4 )
   


 


 


 


 


Net income (loss)

  $ 34,709     $ 19,420     $ (102,827 )   $ (99,079 )   $ (16,717 )
   


 


 


 


 


Net income (loss) per share (basic and diluted)(5)

  $ 0.06     $ 0.03       $(0.15 )     $(0.15 )     $(0.02 )
   


 


 


 


 


Net income (loss) per ADS (basic and diluted)(5)

  $ 0.30     $ 0.15       $(0.77 )     $(0.74 )     $(0.12 )
   


 


 


 


 


Weighted average number of shares outstanding(5)

    576,000,000       654,962,375       669,218,720       668,947,000       671,721,610  

Weighted average number of ADSs outstanding(5)

    115,200,000       130,992,475       133,843,744