As Of               Filer                 Filing    For·On·As Docs:Size             Issuer                      Filing Agent

 3/29/12  Trina Solar Ltd                   20-F       12/31/11   99:17M                                    Toppan Merrill/FA

Document/Exhibit                   Description                      Pages   Size 

 1: 20-F        Annual Report by a Foreign Non-Canadian Issuer      HTML   2.33M 
 2: EX-4.10     Instrument Defining the Rights of Security Holders  HTML    128K 
 3: EX-4.11     Instrument Defining the Rights of Security Holders  HTML    149K 
 4: EX-4.12     Instrument Defining the Rights of Security Holders  HTML    113K 
 5: EX-8.1      Opinion of Counsel re: Tax Matters                  HTML     48K 
 9: EX-13.1     Annual or Quarterly Report to Security Holders      HTML     27K 
10: EX-13.2     Annual or Quarterly Report to Security Holders      HTML     27K 
 6: EX-11.1     Statement re: Computation of Earnings Per Share     HTML     71K 
 7: EX-12.1     Statement re: Computation of Ratios                 HTML     31K 
 8: EX-12.2     Statement re: Computation of Ratios                 HTML     31K 
11: EX-15.1     Letter re: Unaudited Interim Financial Information  HTML     25K 
69: R1          Document and Entity Information                     HTML     50K 
56: R2          Consolidated Balance Sheets                         HTML    173K 
67: R3          Consolidated Balance Sheets (Parenthetical)         HTML     43K 
71: R4          Consolidated Statements of Operations               HTML    107K 
90: R5          Consolidated Statements of Changes in Equity and    HTML    107K 
                Comprehensive Income                                             
58: R6          Consolidated Statements of Cash Flows               HTML    212K 
66: R7          Organization and Principal Activities               HTML     31K 
51: R8          Summary of Principal Accounting Policies            HTML    184K 
41: R9          Allowance for Doubtful Receivables                  HTML     82K 
91: R10         Inventories                                         HTML     49K 
73: R11         Property, Plant and Equipment, Net                  HTML     61K 
72: R12         Prepaid Land Use Right                              HTML     29K 
78: R13         Accrued Expenses and Current Liabilities            HTML     45K 
79: R14         Derivative Financial Instruments                    HTML     90K 
76: R15         Fair Value Measurement                              HTML    211K 
80: R16         Bank Borrowings                                     HTML     94K 
68: R17         Convertible Senior Notes                            HTML     40K 
70: R18         Accrued Warranty Costs                              HTML     42K 
75: R19         Share-Based Compensation                            HTML    103K 
99: R20         Tax Expense                                         HTML    164K 
86: R21         Distribution of Profit                              HTML     31K 
62: R22         Related Party Transactions and Balances             HTML     34K 
74: R23         Commitments and Contingencies                       HTML     49K 
64: R24         Segment Information                                 HTML     62K 
32: R25         Major Customers and Suppliers                       HTML     45K 
87: R26         Additional Information - Financial Statement        HTML    194K 
                Schedule I                                                       
95: R27         Summary of Principal Accounting Policies            HTML    288K 
                (Policies)                                                       
46: R28         Summary of Principal Accounting Policies (Tables)   HTML    140K 
45: R29         Allowance for Doubtful Receivables (Tables)         HTML     74K 
49: R30         Inventories (Tables)                                HTML     43K 
50: R31         Property, Plant and Equipment, Net (Tables)         HTML     52K 
52: R32         Accrued Expenses and Current Liabilities (Tables)   HTML     45K 
25: R33         Derivative Financial Instruments (Tables)           HTML     77K 
84: R34         Fair Value Measurement (Tables)                     HTML    184K 
60: R35         Bank Borrowings (Tables)                            HTML     76K 
63: R36         Accrued Warranty Costs (Tables)                     HTML     41K 
36: R37         Share-Based Compensation (Tables)                   HTML    100K 
98: R38         Tax Expense (Tables)                                HTML    156K 
18: R39         Commitments and Contingencies (Tables)              HTML     45K 
53: R40         Segment Information (Tables)                        HTML     55K 
89: R41         Major Customers and Suppliers (Tables)              HTML     40K 
34: R42         Summary of Principal Accounting Policies (Details)  HTML     57K 
44: R43         Summary of Principal Accounting Policies (Details   HTML     70K 
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48: R44         Summary of Principal Accounting Policies (Details   HTML     82K 
                3)                                                               
57: R45         Summary of Principal Accounting Policies (Details   HTML     31K 
                4)                                                               
24: R46         Allowance for Doubtful Receivables (Details)        HTML     41K 
40: R47         Inventories (Details)                               HTML     44K 
20: R48         Property, Plant and Equipment, Net (Details)        HTML     52K 
88: R49         Prepaid Land Use Right (Details)                    HTML     32K 
33: R50         Accrued Expenses and Current Liabilities (Details)  HTML     47K 
85: R51         Derivative Financial Instruments (Details)          HTML     39K 
37: R52         Derivative Financial Instruments (Details 2)        HTML     30K 
54: R53         Fair Value Measurement (Details)                    HTML     51K 
19: R54         Fair Value Measurement (Details 2)                  HTML     38K 
22: R55         Fair Value Measurement (Details 3)                  HTML     36K 
47: R56         Bank Borrowings (Details)                           HTML     39K 
28: R57         Bank Borrowings (Details 2)                         HTML     47K 
93: R58         Bank Borrowings (Details 3)                         HTML     81K 
59: R59         Bank Borrowings (Details 4)                         HTML     42K 
77: R60         Convertible Senior Notes (Details)                  HTML     93K 
39: R61         Accrued Warranty Costs (Details)                    HTML     34K 
42: R62         Share-Based Compensation (Details)                  HTML    161K 
83: R63         Tax Expense (Details)                               HTML     39K 
81: R64         Tax Expense (Details 2)                             HTML     31K 
61: R65         Tax Expense (Details 3)                             HTML     63K 
82: R66         Tax Expense (Details 4)                             HTML     56K 
38: R67         Tax Expense (Details 5)                             HTML     85K 
65: R68         Distribution of Profit (Details)                    HTML     40K 
94: R69         Related Party Transactions and Balances (Details)   HTML     50K 
21: R70         Commitments and Contingencies (Details)             HTML     47K 
31: R71         Commitments and Contingencies (Details 2)           HTML     41K 
55: R72         Commitments and Contingencies (Details 3)           HTML     38K 
27: R73         Segment Information (Details)                       HTML     37K 
97: R74         Major Customers and Suppliers (Details)             HTML     36K 
35: R75         Additional Information - Financial Statement        HTML     36K 
                Schedule I (Details)                                             
29: R76         Additional Information - Financial Statement        HTML    106K 
                Schedule I (Details 2)                                           
30: R77         Additional Information - Financial Statement        HTML     40K 
                Schedule I (Details 3)                                           
23: R78         Additional Information - Financial Statement        HTML     74K 
                Schedule I (Details 4)                                           
26: R79         Additional Information - Financial Statement        HTML    117K 
                Schedule I (Details 5)                                           
96: XML         IDEA XML File -- Filing Summary                      XML    138K 
43: EXCEL       IDEA Workbook of Financial Reports (.xls)            XLS   2.42M 
12: EX-101.INS  XBRL Instance -- tsl-20111231                        XML   3.22M 
14: EX-101.CAL  XBRL Calculations -- tsl-20111231_cal                XML    349K 
15: EX-101.DEF  XBRL Definitions -- tsl-20111231_def                 XML   1.09M 
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13: EX-101.SCH  XBRL Schema -- tsl-20111231                          XSD    275K 
92: ZIP         XBRL Zipped Folder -- 0001104659-12-022420-xbrl      Zip    300K 

Exhibit 4.11

 

Translation

 

SUPPLEMENTARY AGREEMENT NO. 10 TO
POLYSILICON SUPPLY AGREEMENT

 

Party A’s Agreement No.: SSC00019

Party B’s Agreement No.: TCZ-A1130-0803-CGC-120-7

 

WHEREAS:

 

I)                                       Jiangsu Zhongneng Polysilicon Technology Development Co., Ltd. (hereinafter referred to as “Zhongneng”) and Changzhou Trina Solar Energy Co., Ltd. (hereinafter referred to as “Trina”) entered into the Polysilicon Supply Agreement (Zhongneng’s Agreement No.: SSC000119, Trina’s Agreement No.: TCZ-A1130-0803-CGC-120-0) on March 29, 2008; the Supplementary Agreement (1) to the Polysilicon Supply Agreement (Trina’s Agreement No.: SSC000119, Trina’s Agreement No.: TCZ-A1130-0803-CGC-120-0, hereinafter referred to as the “Supplementary Agreement (1)”) on August 19, 2008; the Supplementary Agreement (2) to the Polysilicon Supply Agreement (Zhongneng’s Agreement No.: SSC000119, hereinafter referred to as the “Supplementary Agreement (2)”) on August 24, 2008; the Supplementary Agreement (3) to the Polysilicon Supply Agreement (Zhongneng’s Agreement No.: SSC000119, Trina’s Agreement No.: TCZ-A1130-0803-CGC-120-G, hereinafter referred to as the “Supplementary Agreement (3)”) on October 26, 2009; the Supplementary Agreement (4) to the Polysilicon Supply Agreement (Zhongneng’s Agreement No.: SSC000119, Trina’s Agreement No.: TCZ-A1130-0803-CGC-120-0, hereinafter referred to as the “Supplementary Agreement (4)”) on March 26, 2010; and the Memorandum (1) of the Supplementary Agreement (4) to the Polysilicon Supply Agreement (Zhongneng’s Agreement No.: SSC000119, Trina’s Agreement No.: TCZ-A1130-0803-CGC-120-0, hereinafter referred to as the “Memorandum (1)”), the Memorandum (2) of the Supplementary Agreement (4) to the Polysilicon Supply Agreement (Zhongneng’s Agreement No.: SSC000119, Trina’s Agreement No.: TCZ-A1130-0803-CGC-120-2, hereinafter referred to as the “Memorandum (2)”), the Memorandum (3) of the Supplementary Agreement (4) to the Polysilicon Supply Agreement (Zhongneng’s Agreement No.: SSC000119, Trina’s Agreement No.: TCZ-A1130-0803-CGC-120-3, hereinafter referred to as the “Memorandum (3)”) and the Memorandum (4) of the Supplementary Agreement (4) to the Polysilicon Supply Agreement (Zhongneng’s Agreement No.: SSC000119, Trina’s Agreement No.: TCZ-A1130-0803-CGC-120-4, hereinafter referred to as the “Memorandum (4)”) on April 6, 2010, May 14, 2010, August 6, 2010 and August 30, 2010, respectively; and the Supplementary Agreement (5) to the Polysilicon Supply Agreement on September 29, 2010; the Supplementary Agreement (6) to the Polysilicon Supply Agreement on October 4, 2010; the Supplementary Agreement (7) to the Polysilicon Supply Agreement on October 30, 2010; the Supplementary Agreement (8) to the Polysilicon Supply Agreement on December 30, 2010 (all the contracts, agreements and memoranda described above are referred to collectively as the “Original Agreements”).

 

1

 

II)                                  Under Article 2 of the Supplementary Agreement (8), Jiangsu Zhongneng Polysilicon Technology Development Co., Ltd. transferred all of its rights and obligations under the Original Agreements with respect to all silicon wafer businesses (including all sales businesses of solar-grade polycrystalline silicon wafers and solar-grade monocrystalline silicon wafers under the Original Agreements), and designated Changzhou GCL Photovoltaic Technology Co., Ltd. to carry out the sales business of silicon wafters under the Original Agreements and subsequent agreements pursuant to the requirements of the Original Agreements.

 

Changzhou Trina Solar Energy Co., Ltd. and Changzhou GCL Photovoltaic Technology Co., Ltd. have made the following supplements to the Original Agreements and the Supplementary Agreements after they fully negotiated on the basis of the principles of equality and willingness:

 

These Original Agreements and the Supplementary Agreements (hereinafter referred to as “this Agreement”) is made on [December                  ], 2010 in Changzhou, China by and between the following parties (hereinafter the “Parties”):

 

Party A: Changzhou GCL Photovoltaic Technology Co., Ltd., whose address is at No.1, Xinxi Road, Xinbei District, Changzhou

 

Party B: Changzhou Trina Solar Energy Co., Ltd., whose address is at No. 2 Tianhe Road, Xinbei District Electronic Industry Park, Changzhou , Jiangsu Province.

 

Article 1                                               Definition

 

Unless otherwise specified herein, the terms used in this Agreement shall have the same meaning as those defined in the Original Agreements:

 

“Silicon Wafers” shall mean and include solar-grade polycrystalline silicon wafers, solar-grade monocrystalline silicon wafers, as well as the solar-grade polycrystalline silicon ingots and monocrystalline silicon rods required for the production of silicon wafers.

 

Article 2                                               Supplementary Requirements

 

2.1                               On the basis of the quantity of supply as agreed in Exhibit (B-3) to the Supplementary Agreement (4) to the Polysilicon Original Agreement and its Supplementary Agreements, Party B confirms that changes need to be done with respect to the quantity of Silicon Wafers to be purchased from Party A starting from (and including) 2011 according to its own production expansion plan (please see Exhibit (C-4) for details), and Party A undertakes that it will supply Silicon Wafers to Party B according to the revised quantity.

 

2.2                               Party B agrees that it will separately accept from Party A Silicon Wafers in the specifications of A grade and 180µm, respectively, on the basis of the specifications of Silicon Wafers as agreed in the Original Agreements and the Supplementary Agreements (please refer to “A-Grade Specification Standards” in Exhibit 2 hereto for the quantity standards of polycrystalline Silicon Wafers, and “180 Specification Standards” in Exhibit 3).

 

2

 

2.3                               The advance payment for Silicon Wafers in 2011 shall be RMB [****]† (in words: Renminbi [****]†).  Party B shall pay to Party A such advance payment by wire transfer in cash no later than June 30, 2011.  The Parties shall separately negotiate the remaining amount of the advance payment.  Before any unanimous agreement is made between the Parties, the non-payment of any outstanding amount since January 1, 2009 shall not be deemed as a breach of contract.

 

2.4                               The Parties undertake that:

 

2.4.1                     the supply of Silicon Wafers shall be continued pursuant to the terms and conditions of the Original Agreements and the Supplementary Agreements.

 

2.4.2                     Party A will satisfy the demand of Party B for Silicon Wafers by way of investment in and construction of additional production and auxiliary facilities for Silicon Wafers.  It will also supply Silicon Wafers to Party B pursuant to the terms and conditions of the Original Agreements and the Supplementary Agreements even if there is shortage of Silicon Wafers in the market.  Save for any reason other than force majeure or any breach of contract by Party B, Party B may require Party A to assume the liabilities for any breach of contract if Party A fails to meet the quantity of supply as agreed in Article 2.1 hereof due to its own fault.

 

2.4.3                     if Party B needs to further purchase any Silicon Wafer other than the quantity of supply as agreed in Article 2.1 above after the execution hereof, Party B shall have the priority right to purchase Silicon Wafers from Party A provided that the same conditions are provided.

 

2.4.4                     Party B undertakes that the quantity of Silicon Wafers purchased from Party A shall not be less than 50% of its total purchases.

 

2.4.5                     Party A undertakes that the average unit price of Silicon Wafer sold to Party B for 2011 shall be less than or equal to Renminbi [****]† a piece (RMB[****]†/pc).

 

2.4.6                     Party A and Party B agree to discuss the price of Silicon Wafers for the second half of 2011 in early May 2011.  If no agreement can be reached in respect thereof, the price mechanism agreed in the Original Agreements and the Supplementary Agreements shall continue to be adopted.

 

2.4.7                     The price adjustment provision of this Supplementary Agreement shall continue to be implemented pursuant to the Supplementary Agreement (4).

 

† This portion of the Supplementary Agreement No. 10 to Polysilicon Supply Agreement has been omitted and filed separately with the Securities and Exchange Commission, pursuant to Rule 24b-2 under the Securities Exchange Act of 1934.

 

3

 

Article 3                                               Miscellaneous

 

3.1                               This Agreement, which is another Supplementary Agreement to the Original Agreements, will only make supplements or changes to those matters stipulated herein.  The other provisions of the Original Agreements and the Supplementary Agreements shall remain to have the original legal effect.  In the event of any conflicts between the Original Agreements, the Supplementary Agreements and this Agreement, the document executed at the later time shall prevail.

 

3.2                               Any matters not covered herein, such as confidentiality, governing law and dispute resolution, shall remain to be dealt with pursuant to the Original Agreements and the Supplementary Agreements.

 

3.3                               This Agreement shall become effective once it is signed by the respective legal representatives or authorized representatives of the Parties.

 

3.4                               This Agreement is executed in four originals with each Party holding two originals.  Each of them shall have the same legal effect.

 

Party A: Changzhou GCL Photovoltaic Technology Co., Ltd. (Chop)

 

Legal representative or authorized representative (Signature):

 

[Chop of Changzhou GCL Photovoltaic Technology Co., Ltd. is affixed]

 

/s/                                   January 11, 2011

 

Party B: Changzhou Trina Solar Energy Co., Ltd. (Chop)

 

Legal representative or authorized representative (Signature):

 

[Chop of Changzhou Trina Solar Energy Co., Ltd. is affixed]

 

/s/                                   January 11, 2011

 

4

 

Exhibit 2: “A-Grade Specification Standards”

 

[Logo] GCL	Product Specifications		Product Name		156 x 156 Polycrystalline Silicon Wafers
			Document Name		Product Specification Standards for A-Grade Polycrystalline Silicon Wafers
		Geometry	TTV, Warpage	Saw Mark		Edge Chip
Materials properties
Growth method		DSS
Donor type/Dopant		P/Boron
Oxygen content		<1.0 x 1018 atoms/cm3
Carbon content		<8.0 x 1017 atoms/cm3
Electrical properties
Resistivity		0.8 ~ 3 Ω.cm
Lifetime		>2 µs (silicon chunks)
Geometry
Width		156 ± 0.5 mm		156 ± 0.5 mm
Squareness		90 ± 0.3°
Diameter		219.2 ± 0.6 mm		219.2 ± 0.5 mm
Thickness		180 ± 20 µm, 190 ± 20 µm, 200 ± 20 µm,
TTV		<40µm	<50µm	<40µm		<40µm
Saw marks		<25µm	<25µm	<30µm (no color difference)		<25µm
Edge chip		Width <0.3 mm, length <0.5 mm; Max. 2 /piece; V-shape chip unacceptable				0.3 mm< width<0.5 mm, 0.5 mm< length<1 mm; Max 2/piece; V-shape chip unacceptable
Warpage		<75µm	<100µm	<75µm		<75µm
Microcrystal		Single area < 3 x 3 mm2; total area < 3 x 3 cm2
Crack, hole		None
Surface quality		No damages on the surface, no stains, no watermark, no spot
Package & Labels
Package		GCL standard package, 100 pcs/package, 300 pcs/box, chip rate during transportation < 3%
Labels		P.O. No., Lot No., No. of wafers, Dimension, etc.

 

6

 

Exhibit 3: “Specification Standards for Polycrystalline Silicon Wafers”

 

Trinasolar
Changzhou Trina Solar Energy Co., Ltd.
		Product Name	Multi-Crystalline Si Wafer
		Document Name	156*156 Multi-Crystalline Wafer Specification
Product Specifications		Document Number	PS-WX-W-0004
		Version Number	A
Material properties
Property	Specification		Referenced Standard	Random Checking Proposal
Crystal Growth Method	DSS
Donor Type/Dopant	P/Boron		ASTM F42
Oxygen Content	< 1 x 1018 atoms/cm3 (head of silicon robs) or pursuant to the specifications of raw materials supplied		ASTM F1188/GB1557-1989	AQL=0.25
Carbon Content	< 5.0 x 1017 atoms/cm3 (tail of silicon robs) or pursuant to the specifications of raw materials supplied		ASTM F1391/GB1558-1997
Electrical properties
Resistivity	0.5 – 3 ohm-cm		ASTM F43
Lifetime	>1.0µs, or pursuant to the specifications of raw materials supplied (inspected and tested by sorting machine)		GB1553-1997	AQL=0.25
Geometry
Geometry	Square
Dimensions (WxW)	156.0 x 156.0 (±0.5) mm
Right Angle	90 ± 0.3°
	1) Hypotenuse 0.5 – 2.0 mm (reference)
Chamfer Size	2) Cahtetus 0.35 – 1.42 mm (reference)
	3) Chamfer angle 45° (reference)
Thickness	180/190/200µm (average value), specification ± 20µm, or pursuant to the specifications of raw materials supplied		ASTM F533/GB6618-1995 Q/320411 AFY03-2006
Blade wafer	Not acceptable (a blade wafer is called if the thickness of its edge at 2 mm exceeds the requirement)
TTV	< 40µm		ASTM F533, F657/GB6618-
Saw marks	1) Depth < 20µm (the difference between the highest and lowest points of Rt);			AQL=1.0
	2) Saw marks of no color difference and saw marks on the edge;
Surface quality	Cleaned, no grease stains, inclusion or pin hole
	1) Width of edge chip < 0.5 mm, length < 1.0 mm; quantity < 2;
Edge Chip	2) No V-shape chip, crack and corner missing; width < 0.5 mm, length < 1.0 mm; count < 2;
Surface Chip	Depth < 0.5 mm, length < 3.0 mm
Warpage	< 75µm		ASTM F657/GB6619 or

 

7

 

					6620-
					1995;          Q/320411 AFY03-2006
Microcrystal		Single area < 3*3 mm2, total area < 3*3 cm2
Package & Labels
Package		Trina Standard, 100 pcs/package;
Labels		Part No., P.O. No., Lot No., No of wafers, Dimension
Additional Note: In the event of any discrepancy between all the product specifications and the agreement, the agreement shall prevail.
Originator			Review		Approval
Signature:	Date:		Signature:	Date:	Signature:	Date:
Notes: 1. Defective rate < 0.3%; 2. Trial production of 2,000 pcs per batch, defective rate of electric property of battery < 0.5%.  page 1/1

 

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  As Of               Filer                 Filing    For·On·As Docs:Size             Issuer                      Filing Agent

11/08/12  SEC                               UPLOAD¶    10/04/17    1:126K Trina Solar Ltd.
 9/24/12  SEC                               UPLOAD¶    10/04/17    1:157K Trina Solar Ltd.